Apparatus for air cooling of an electronic device

ABSTRACT

An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.11/357,311 entitled “APPARATUS FOR AIR COOLING OF AN ELECTRONIC DEVICE”filed Feb. 17, 2006 which is a divisional of U.S. Pat. No. 7,035,102entitled “APPARATUS FOR AIR COOLING OF AN ELECTRONIC DEVICE” filed Mar.31, 2004 which in-turn claims the benefit of U.S. ProvisionalApplication No. 60/535,279 entitled QUICK RELEASE STRUCTURES FOR ACOMPUTER, filed Jan. 8, 2004, all of which are incorporated herein byreference in their entirety and for all purposes.

BRIEF DESCRIPTION OF THE INVENTION

This invention relates to electronic devices. More specifically, thisinvention relates to the air cooling of electronic devices.

BACKGROUND OF THE INVENTION

As electronic devices increase in processing power and speed, theirprocessors generate more and more heat, thus exacerbating wear and tearon various components due to thermal cycling and otherwise compromisingtheir performance. Such temperature-related problems only continue togrow as processor speeds continue their steady march upward. The coolingof these processors, and other heat producing elements, has thereforebecome an important issue affecting the performance of modern electronicdevices such as computers.

To this end, methods have been applied in the past to reduce theoperating temperatures of electronic devices. For example, variousliquid cooling systems have been employed to cool processors with wateror other liquids. However, liquid cooling systems are typically bulky,expensive, and upon leaking, risk severe damage to the electronicdevices in which they are installed. Fans for air cooling are anothercommon solution to the problem of excessive heat generation. Such fansare an inexpensive and relatively reliable solution, and do not sufferfrom some of the drawback of liquid cooling systems, such as the risk ofleaks. Ongoing efforts thus exist to improve the effectiveness andcooling ability of air cooling systems.

SUMMARY OF THE INVENTION

Broadly speaking, the invention pertains to improving the air cooling ofelectronic devices. A contoured panel is employed to channel the flow ofair from a fan more directly onto an electronic device's sources ofheat. In this manner, the heat dissipation ability of existing aircooling devices is increased without increasing their fan speeds, or anyother parameters which may have potentially detrimental effects such asincreased power consumption, noise generation, or the like.

The invention can be implemented in numerous ways, including as amethod, system, device, apparatus, or computer readable medium. Severalembodiments of the invention are discussed below.

As a contoured panel for directing a flow of air within an electronicdevice, one embodiment of the invention comprises a panel configured tobe removably placed proximate to an electronic device, the electronicdevice having a heat producing element and a fan, the panel furtherhaving a contoured portion configured to be placed proximate to the fanso as to direct a flow of air from the fan across the heat producingelement, the flow of air facilitating the cooling of the heat producingelement.

As an air-cooled electronic device, one embodiment of the inventioncomprises a housing and a microprocessor and a fan within the housing.The panel is configured to be removably placed proximate to the housing.The panel also has a contoured portion configured to direct a flow ofair from the fan across the microprocessor so as to cool themicroprocessor.

As an electronic device housing, one embodiment of the inventioncomprises a first portion configured to support a microprocessor, and asecond portion configured to support a first fan. A removable, contouredportion configured to direct air from the first fan across themicroprocessor, so as to cool the microprocessor.

Other aspects and advantages of the invention will become apparent fromthe following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the invention, reference should be made tothe following detailed description taken in conjunction with theaccompanying drawings, in which:

FIG. 1 illustrates a contoured panel constructed in accordance with anembodiment of the invention.

FIG. 2 illustrates a computer system with a removable contoured panelconstructed in accordance with an embodiment of the invention.

FIG. 3 illustrates a cross section of a computer system with discretethermal zones constructed in accordance with an embodiment of theinvention.

FIG. 4. illustrates a top view of a thermal zone and contoured panelconstructed in accordance with an embodiment of the invention, in whichperipheral cards are more effectively cooled.

FIG. 5. illustrates a top view of a thermal zone and contoured panelconstructed in accordance with an embodiment of the invention, in whicha microprocessor is more effectively cooled.

FIG. 6 illustrates a block diagram of a sensor and feedback system fordetermining whether a contoured panel is correctly positioned inaccordance with an embodiment of the invention.

Like reference numerals refer to corresponding parts throughout thedrawings.

DETAILED DESCRIPTION OF THE INVENTION

Fans are commonly used within electronic devices to direct a flow of airover microprocessors and other heat producing elements. In oneembodiment, the invention discloses a contoured panel that channels thisflow of air more directly over these elements. In this manner, the samefan, run at the same speed, more effectively cools microprocessors andother heat producing elements than if the panel were not present.

In some embodiments, it is of additional benefit to employ a sensor todetermine whether the contoured panel is present and properly placed. Ifit is not, measures can then be taken to reduce the heat generated bythe heat producing elements. For example, a warning can be displayed, orthe microprocessor can be instructed to enter sleep mode.

FIG. 1 illustrates isometric front and back views of a contoured panelconstructed in accordance with an embodiment of the invention. Thecontoured panel 10 has a first contoured portion 20 and a secondcontoured portion 30, as well as tabs 40. The panel 10 is alsoconfigured with a handle 50 so as to be removable from a computer orother electronic device. In operation, the contoured panel 10 is placedproximate to fans within an electronic device, so that the contouredportions 20, 30 channel air from the fans more directly onto heatproducing elements such as microprocessors. The handle 50 facilitatesplacement of the panel 10, and the panel 10 can be held in place withthe aid of the tabs 40. The tabs 40 can also be employed to determinewhether the panel 10 is in place, or missing/ajar. Sensors such asproximity sensors or optical sensors can be employed to determine thepresence of the tabs 40. For example, the tabs 40 can be metallized soas to trigger proximity sensors or reflect light from an optical sensor,which then alerts the system to the presence or absence of the panel 10.If the panel 10 is absent, the electronic device can be designed toreduce its processing speed or otherwise conserve power so as to reduceits temperature.

FIG. 2 illustrates a computer system 110 employing such a contouredpanel 10. Shown is an exploded view illustrating the placement ofvarious components within the housing 100 of the computer system 110.The computer system 110 contains a number of known components such asfans 120 for cooling, a microprocessor 130 (not seen from thisperspective), cooling fins 140 mounted on and configured to cool themicroprocessor 130, and peripheral cards 150.

Commonly, the abovementioned components are placed in the housing 100according to known techniques, and the panel 10 and door 160 are thenaffixed to the housing 100. A shelf 170 within the housing 100 ispositioned so as to divide the housing 100 into, in this embodiment, atleast two distinct thermal zones. The peripheral card 150 is placedwithin the first thermal zone 180, where it is cooled by the leftmostfan 120A. Similarly, the microprocessor 130 and cooling fins 140 areplaced within the second thermal zone 190 where they are cooled by therightmost fan 120B. Rear fans 120C, shown immediately behind the coolingfans 140, are not necessary to the invention but often aid in cooling byfurther drawing air across various components within the two thermalzones 180, 190. The fans 120A-C are shown as individual components, butcan be configured as removable assemblies that can be placed at variouspoints within the housing 100 so as to alter the location and propertiesof various thermal zones. For instance, it may sometimes be desirable toplace certain fans closer to the microprocessor 130, or insert multiplefans into the same thermal zone, during times of heavy operation. One ofskill will realize that the invention encompasses any number and type offans, placed in any configuration within the various thermal zones.

FIG. 3 illustrates a cross sectional view of the computer system 110 ofFIG. 2, more clearly highlighting the two thermal zones 180, 190, andthe air flow through each. Recall that the thermal zones 180, 190 aredivided according to the shelf 170, which is placed so as to createseparate thermal zones for the microprocessor 130 and peripheral cards150, as the peripheral cards 150 often generate a different amount ofheat than the microprocessor 130, and often can be cooled at differentrates. It should be noted, though, that the shelf 170 can be placed atany location within the housing 100 so as to create thermal zonesencompassing any combination or permutation of the microprocessor 130,peripheral cards 150, or other heat producing elements or components.For example, additional shelves can be placed above or below the thermalzones 180, 190 so as to further isolate various heat producing elementsinto separate thermal zones.

In the first thermal zone 180, a fan 120 directs a flow of air (shown bythe arrows) past the peripheral cards 150. Often, microprocessors 130consume more power and thus generate more heat than peripheral cards150. Consequently, in the second thermal zone 190, two fans 120 direct aflow of air through the cooling fins 140 and over the microprocessor130. Here, a dual microprocessor 130 configuration is shown containingtwo processors. Two fans are employed to reflect the extra cooling oftenrequired by this configuration. However, any number of cooling fans 120can be used in any thermal zone. In each thermal zone, air enters andexits through known openings in the front panel 200 and rear panel 210,respectively.

In many computers, fans are already used to cool components such as themicroprocessor 130. However, dividing the interior of the housing 100into separate thermal zones 180, 190 allows for separate components tobe cooled at different rates and/or maintained at differenttemperatures. The maintenance of separate thermal zones is further aidedby the contoured panel 10, which is configured with contoured portions20, 30 that can be specifically shaped for, and placed in, each thermalzone 180, 190. FIG. 4 illustrates a cutaway top view of the firstthermal zone 180 with the panel 10 placed so as to direct the flow ofair within. As can be seen, the fan 120 directs a flow of air into thehousing 100 and through the first thermal zone 180. In many housings notcontaining a contoured portion 20, some of the air passes over theperipheral cards 150 (which contain heat producing elements such asdedicated processors that are simply another form of microprocessor130), while some does not, often simply passing through the remainingspace 220 where it does not help to cool the peripheral cards 150.However, the contoured portion 20 is designed to protrude into thisremaining space 220, thus channeling the flow of air more directly overthe peripheral card 150. For any constant fan 120 speed, one of skillwill observe that air will flow over the peripheral card 150 faster inthe presence of the contoured portion 120 than in its absence, as thecontoured portion 20 reduces the area through which air may flow.Consequently, the ability of fans 120 to cool heat producing elementssuch as the peripheral card 150 is increased. As above, air may exit thehousing 100 through any opening in the rear panel 210, and an additionalfan 120 may be placed near the rear panel 210 so as to direct more airout of the housing and establish greater airflow through the firstthermal zone 180.

Similar to FIG. 4, FIG. 5 illustrates a cutaway top view of the secondthermal zone 190 with the panel 10 placed so that the second contouredportion 30 more effectively directs airflow across the microprocessor130 and cooling fins 140. Here, the fan 120 directs a flow of air intothe housing 100. The contoured portion 30 protrudes into the secondthermal zone 190 so as to direct more of the airflow across themicroprocessor 130 and through the cooling fins 140, thus better coolingthese components.

The division of the housing 100 into multiple thermal zones, withcontoured portions tailored to each, allows different components to becooled at different rates if necessary. For example, it is possible forelectronic devices to contain multiple microprocessors 130. In caseswhere such microprocessors 130 are all placed within a single thermalzone, it is often the case that that thermal zone generates much moreheat than the others. The invention thus contemplates a contouredportion tailored to the demands of that thermal zone, configured so asto direct airflow over each microprocessor 130. In this regard, itshould be observed that the invention includes panels having any numberof contoured portions, each specifically tailored to direct airflowwithin any number of thermal zones that each having different coolingneeds.

It will be apparent to one of skill that the specific geometry andplacement of the contoured portions 20, 30 acts to more effectivelydirect air across components such as the peripheral card 150 andmicroprocessor 130. For example, the first contoured portion 20 isdesigned with a length that is as long or longer than many peripheralcards 150 so as to more effectively cool the entire length of the cards150. However, it should be understood that the invention is not limitedto the specific geometries and placements shown. For example, theinvention contemplates contoured portions 20, 30 whose geometries aredesigned according to known principles for optimizing the cooling ofheat producing elements within the space constraints of the housing 100.The invention simply discloses contoured portions of any specificgeometry that acts to more directly channel a flow of air across acomponent of an electronic device. Space constraints, the location ofother components, and the like may require that the contoured portions20, 30 look different than shown, and those of skill will realize thatsuch alternate configurations remain within the scope of the invention.

A further advantage of the invention can be achieved if the panel 10 ismade of a transparent material, such as many commonly-used plastics.Once installed in the housing 100, such a transparent panel 10 wouldallow for visual inspection of various components of the computer system110 without disturbing the flow of air through the various thermalzones, or alerting the system 110 to the absence of the panel 10. Inthis manner, visual inspections of the computer system 110 can beperformed while still maintaining the added cooling of the panel 10.

Attention now turns to attachment of the panel 10 to the housing 100. Itis beneficial to design the panel 10 to be easily removable so that thevarious components can be more effectively cooled without impedingaccess to the interior of the housing 100. It is also beneficial todetermine whether the panel 10 is present and properly positioned, so asto determine the degree to which components such as the microprocessor130 are cooled. Specifically, when the panel 10 is present, themicroprocessor 130 may be operated at higher speeds, thus generatingmore heat, than if the panel 10 were absent.

To that end, FIG. 6 illustrates a block diagram of a sensor and feedbacksystem for determining whether a contoured panel is correctlypositioned. A sensor 240 is located on or in the housing 110, and placedin electrical communication with a processor 230. The processor 230 is,in turn, in electronic communication with the microprocessor 130 and fan120. The sensor 240 can be configured as a known optical sensor thatemits a beam of light and receives a reflected signal back. In thisconfiguration, the tabs 40 of the panel 10 are metallized reflectivetabs capable of reflecting light (or another signal) back to the sensor240 when they are properly positioned within the housing 110.

In operation, the panel 10 is designed so that its tabs 40 can be fittedwithin corresponding slots in the housing 100. The sensor 240 iscommonly placed within the housing in proximity to these slots, so thatwhen the panel 10 is properly fitted on the housing 100, the reflectiveportion 250 of its tabs 40 reflects light back to the sensor 240. Thesensor 240 indicates the presence of a reflected light signal back tothe processor 230. If the panel 10 is properly placed so as to aid inthe cooling of components, normal operation of the microprocessor 130,fan 120, and other components ensues. However, the processor 230 can beprogrammed to act in a number of ways upon receiving an indication fromthe sensor 240 that the panel 10 is not properly placed. For instance,the processor 230 can be programmed to instruct the microprocessor 130to issue a warning message to users indicating that the panel is missingand/or improperly placed, to enter sleep mode, to reduce itsfunctionality or processing speed, or even to shut down. It can alsodirect the fan 120 to speed up. Many other variations exist, such asdirecting the microprocessor 130 to enter sleep mode after the panel 10has been missing for an amount of time. One of skill will realize thatthese and other variations fall within the scope of the presentinvention, which simply discloses the sensing of the panel 10 andresulting control of the electronic device's functionality.

One of skill will also realize that the invention is not limited to theconfiguration of FIG. 6. Rather, other configurations are contemplatedby the invention. For example, the microprocessor 130 can receivefeedback directly from the sensor 240, without need for a dedicatedprocessor 230 (in certain embodiments it is, of course, preferable tomaintain a dedicated processor 230 to, for example, reduce the demandsplaced on the microprocessor 130). Such a microprocessor 130configuration can also control the fan 120 directly. Likewise, thesensor 240 need not be an optical sensor, but rather another form ofknown proximity sensor such as a pressure sensor or capacitativeproximity sensor. Finally, while the components and devices shown inFIG. 6 can often be placed within the housing 100, the invention doesnot require such an arrangement. Rather, components such as the sensor240 may be located outside, or even remote from, the housing 100.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the invention.However, it will be apparent to one skilled in the art that the specificdetails are not required in order to practice the invention. In otherinstances, well-known circuits and devices are shown in block diagramform in order to avoid unnecessary distraction from the underlyinginvention. Thus, the foregoing descriptions of specific embodiments ofthe present invention are presented for purposes of illustration anddescription. They are not intended to be exhaustive or to limit theinvention to the precise forms disclosed. Obviously many modificationsand variations are possible in view of the above teachings. For example,the invention contemplates panel contours of any shape suitable forcooling components of any geometry, within any number of thermal zones.The invention also contemplates determining the presence of panelsaccording to signals from any known sensor, optical or otherwise. Theembodiments were chosen and described in order to best explain theprinciples of the invention and its practical applications, to therebyenable others skilled in the art to best utilize the invention andvarious embodiments with various modifications as are suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the following claims and their equivalents.

1. A contoured panel for directing a flow of air within an electronicdevice, comprising: a panel configured to be removably placed proximateto an electronic device, the electronic device having a heat producingelement and a fan, the panel further having a contoured portionconfigured to be placed proximate to the fan so as to direct a flow ofair from the fan across the heat producing element, the flow of airfacilitating the cooling of the heat producing element.
 2. The contouredpanel of claim 1, the electronic device having a first heat producingelement and a second heat producing element, and first and second fans,the panel further having first and second contoured portions, the firstcontoured portion configured to direct a first flow of air from thefirst fan across the first heat producing element, and the secondcontoured portion configured to direct a second flow of air from thesecond fan across the second heat producing element.
 3. The contouredpanel of claim 1 wherein the panel is transparent.
 4. An air-cooledelectronic device, comprising: a housing; a microprocessor and a fanwithin the housing; and a panel configured to be removably placedproximate to the housing, the panel having a contoured portionconfigured to direct a flow of air from the fan across themicroprocessor so as to cool the microprocessor.
 5. The air-cooledelectronic device of claim 4, the electronic device having a firstmicroprocessor and a second microprocessor, and first and second fans,the panel further having first and second contoured portions, the firstcontoured portion configured to direct a first flow of air from thefirst fan across the first microprocessor, and the second contouredportion configured to direct a second flow of air from the second fanacross the second microprocessor.
 6. The air-cooled electronic device ofclaim 4 wherein the panel is transparent.
 7. An electronic devicehousing, comprising: a first portion configured to support amicroprocessor; a second portion configured to support a first fan; aremovable, contoured portion configured to direct air from the first fanacross the microprocessor, so as to cool the microprocessor.
 8. Theelectronic device housing of claim 7 further comprising a third portionconfigured to support a peripheral card and a fourth portion configuredto support a second fan, wherein the contoured portion is furtherconfigured to direct air from the second fan across the peripheral cardso as to cool the peripheral card.
 9. The electronic device housing ofclaim 7 further comprising a third portion configured to support asensor for determining whether the contoured portion has been removed.10. The electronic device housing of claim 9 wherein the sensor is anoptical sensor configured to emit a beam of light and to detect areflection of the beam of light so as to determine whether the panel hasbeen removed, and wherein the contoured portion further comprises areflective tab configured to reflect the beam of light back to theoptical sensor.
 11. The electronic device housing of claim 7 wherein thecontoured portion is transparent.